Package Reliability Engineer
Core
Coordinate package qualification for new semiconductor products and innovative builds, developing reliability test plans and managing root cause analysis for qualification failures and RMAs.
Role type
Package Reliability Engineer
Builds
Reliability test plans, qualification reports, and corrective action plans for memory and storage products
Domain
Semiconductor manufacturing, micro electronic packaging, quality engineering
Deliverable
product features
Required skills
semiconductor package assembly processes, surface mount methods, mechanical and material interaction effects, thermomechanical stress analysis, reliability test techniques, acceleration models, sampling statistics, root cause analysis, failure analysis, technical reporting
Preferred skills
Micro Electronic Packaging experience, Quality/Reliability Engineering experience, backend manufacturing software systems, AI tool utilization (Microsoft Copilot, GenieLLM)
Technologies
Microsoft Copilot, GenieLLM, AI agents
Responsibilities
coordinate package qualification efforts, develop reliability test plans, manage root cause analysis for failures and RMAs, prepare detailed reports, assist internal and external customers with quality concerns
Seniority
Entry to Mid-level, hands-on IC
