APTD Equipment Development Engineer
Core
Develop and optimize wafer and assembly equipment for post-probe processing to meet physical and electrical requirements for memory products.
Role type
Senior IC equipment development engineer (hardware/AI)
Builds
Wafer and assembly equipment, hardware roadmaps, and innovative solutions for next-generation products
Domain
Semiconductor manufacturing, memory and storage solutions
Deliverable
production ML models | product features
Required skills
Design of experiment (DOE), Statistical Process Control (SPC), defect analysis, data analysis, root-cause analysis, model-based problem solving, statistics, hands-on experience with wafer/assembly tools and overlay systems, Artificial Intelligence (AI) application
Preferred skills
Strategic direction guidance, independent project management, multi-tasking
Technologies
Wafer tools, assembly tools, overlay systems, AI/ML frameworks
Responsibilities
Develop strategies to improve equipment maturity for First of a Kind (FOAK) hardware; Develop 5+ year hardware roadmaps for post-probe wafer and die processing; Optimize equipment to reduce cost and improve capability; Collaborate with process development teams on innovative solutions; Conduct failure mode analysis to drive development projects with OEM vendors; Perform fundamental research for next-generation equipment; Support equipment transfer to production facilities
Seniority
Senior, hands-on IC
