Shift Process Engineer, Advanced Packaging Technology Development (APTD)
Core
Develop and optimize assembly processes for AI-assisted memory and storage packaging solutions to improve yield, quality, and operational performance.
Role type
Shift Process Engineer (Advanced Packaging)
Builds
Next-generation memory and storage solutions for AI and high-performance computing
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features
Required skills
Failure analysis, FMEA, 8D, SPC, FDC, data analysis for process improvement, AI-enabled tool usage
Preferred skills
Semiconductor manufacturing process knowledge, gas behavior and chemical reactions understanding, APC, RMS, Microsoft Office proficiency
Technologies
Copilot, Claude, Gemini, SPC, FMEA, 8D, FDC, APC, RMS
Responsibilities
Diagnose and resolve process issues using failure analysis and statistical methods; Analyze manufacturing data to drive yield and quality improvements; Partner with cross-functional teams to optimize process performance; Monitor process trends and implement capability improvements; Support evaluation of AI-enabled process changes and materials