Senior Engineer, Unit Process Modeling
Core
Develop physics-based predictive models, Digital Twins, and AI-driven solutions for semiconductor process optimization, yield improvement, and design-space exploration across DRAM, NAND, and advanced packaging technologies.
Role type
Senior IC process modeling engineer (semiconductor manufacturing)
Builds
Physics-informed composite AI models, Digital Twins, and multiphysics simulations for fab technology co-optimization
Domain
Semiconductor manufacturing (memory/storage) + Computational physics + AI/ML
Deliverable
production ML models | product features
Required skills
algorithm development, numerical methods, scientific computing, plasma/FPM/HAR etching modeling, wet process/chemical etching modeling, thermodynamics, physics, chemistry, computational materials science, regression, neural networks, process/multi-physics modeling, Linux, Bash, Python, FORTRAN, C++, OpenFOAM, ANSYS Fluent, COMSOL, HPEM
Preferred skills
GenAI, LLM-powered copilots, RAG systems, agentic AI workflows, conference paper publication
Technologies
OpenFOAM, ANSYS Fluent, COMSOL, HPEM, Python, FORTRAN, C++, Bash
Responsibilities
Develop and deploy Digital Twins and predictive models spanning process, wafer, die, package, and manufacturing domains; Develop structural and multiphysics models to evaluate process-structure-performance interactions; Build physics-informed composite AI models to accelerate technology development and yield improvement; Apply advanced computational methods and sparse-data modeling techniques for complex semiconductor challenges; Utilize GenAI and agentic AI workflows to integrate engineering tools and manufacturing data; Collaborate across global engineering teams to translate modeling insights into actionable technology decisions
Seniority
Senior, hands-on IC
