Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Lead a team to develop and execute reliability test flows for High Bandwidth Memory (HBM) products, driving DPM reduction and root cause analysis for defectivity and intrinsic reliability issues.
Role type
Senior IC Product Engineering Manager (Reliability)
Builds
HBM DRAM and Interface die products for data centers and AI applications
Domain
Semiconductor manufacturing / Memory / Reliability Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Statistics and data analysis, Circuit analysis, Project management, Cross-functional collaboration, Team leadership, AI/ML application for reliability
Preferred skills
Product Engineering experience, AI strategy implementation, Process conversion expertise
Technologies
EFA, PFA, Claude code, Agentic AI, Machine Learning (regression, classification, anomaly detection, clustering)
Responsibilities
Define and develop reliability stress test flows and plans; Drive extrinsic and intrinsic reliability improvements to meet Quality, Cost, and Cycle Time KPIs; Debug and resolve qualification and RMA failures via failure analysis; Provide recommendations for fab process conversions to improve yield and reduce cost; Manage risks associated with process conversions; Mentor engineers on AI adoption and reliability workflows; Collaborate with Fab, Design, and Quality teams on product qualification.
Seniority
Senior, hands-on IC with team leadership
