Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)
Core
Spearhead and develop a high-performing team driving intrinsic and extrinsic reliability test development and execution for Micron's latest HBM products (DRAM, Interface die, and stacked products) to reduce DPM and improve yield.
Role type
Senior IC Product Engineering Manager (HBM Reliability)
Builds
High Bandwidth Memory (HBM) products for data centers and AI applications
Domain
Semiconductor manufacturing / Memory / Reliability Engineering
Deliverable
production ML models
Required skills
Reliability test flow development, Root cause analysis (EFA/PFA), Statistics and data analysis, Circuit analysis, Process conversion management, AI/ML application (regression, classification, anomaly detection), Team leadership, Project management
Preferred skills
Product Engineering experience, AI-first mindset, Cross-functional collaboration
Technologies
EFA, PFA, Claude code, Agentic AI, Machine Learning frameworks
Responsibilities
Define and develop reliability stress test flows and plans; Drive extrinsic and intrinsic reliability (DPM reduction) via optimized manufacturing test flows; Debug and resolve qual/RMA failures using electric and physical failure analysis; Provide recommendations to fab teams for new process conversions to reduce cost and increase yields; Manage risks associated with DPM process conversions; Mentor engineers on AI adoption and embed AI/automation into reliability workflows; Collaborate with Fab, TD, GQ, Design, and System teams.
Seniority
Senior, hands-on IC with team leadership
