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Dry Etch MDE Principal Lead Engineer

Boise, ID - Main Site💼 Full-time🗓 2026-07-10 → 2026-07-31

Core

Lead dry etch development execution and team management for next-generation DRAM manufacturing.

Role type

Principal Lead Engineer (Dry Etch Manufacturing Development)

Builds

Next-generation DRAM memory and storage solutions

Domain

Semiconductor manufacturing / Dry etch process development

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

dry etch process development, plasma fundamentals, team leadership, operational performance management, cross-functional partnership, workflow optimization

Preferred skills

PhD or MS in relevant field, 5+ years experience (or 10+ with BS), deep knowledge of plasma dry etch chemistries, shift-based manufacturing experience, AI application in engineering workflows

Technologies

dry etch tools, plasma systems, semiconductor manufacturing equipment

Responsibilities

Lead dry etch development execution and ensure efficient wafer flow and data quality; Manage and develop engineers across shifts through coaching and mentorship; Drive operational performance including cycle time, tool readiness, and execution metrics; Partner with process, integration, and manufacturing teams to resolve issues; Improve systems and workflows to increase development throughput

Seniority

Principal, hands-on IC with people leadership

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