Lead Staff Engineer / Lead Principal Engineer PD SG Diffusion/Implant
Core
Leading a team of engineers to develop and optimize semiconductor manufacturing processes for 3D NAND nodes, specifically focusing on Diffusion (DF) and Implant (IMP) modules.
Role type
Lead Staff/Principal Process Engineer (Diffusion & Implant)
Builds
Process modules for 3D NAND nodes
Domain
Semiconductor manufacturing / 3D NAND
Deliverable
production ML models | product features | infrastructure
Required skills
Process development, DOE-based experimentation, process integration, high-volume manufacturing transfer, supplier management, data analytics, AI/ML application, team leadership, process monitoring and control
Preferred skills
AI/ML techniques for predictive modeling, process simplification, cost reduction, advanced data analytics
Technologies
AI/ML tools, data analytics platforms, semiconductor process equipment
Responsibilities
Lead, hire, and mentor a team of Diffusion & Implant engineers; Own and drive DF and IMP process module development including cell development and process characterization; Drive execution of process development activities aligned with TD roadmap; Collaborate with Process Integration, Manufacturing Development, and Equipment Engineering teams; Lead transfer of processes to high-volume manufacturing; Drive DOE-based experiments to optimize process performance; Implement advanced process monitoring and control strategies; Identify and lead process simplification and cost reduction initiatives; Partner with equipment and materials suppliers to co-develop next-generation solutions; Drive adoption of AI/ML techniques to improve process understanding and optimization.
Seniority
Senior, hands-on IC with team leadership
