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MGR, MANUFACTURING ENGRG; MFG

Aizuwakamatsu-Shi, Fukushima, Japan💼 Full-time🗓 2026-07-10 → 2026-07-22

Core

Lead on-site equipment and process engineering for front-end semiconductor manufacturing (8-inch), specifically diffusion and ion implantation, to stabilize equipment performance and improve factory productivity.

Role type

Manufacturing Engineering Manager (Semiconductor Equipment/Process)

Builds

Mass production technology, new equipment, and optimized processes for semiconductor wafers.

Domain

Semiconductor manufacturing (Front-End, 8-inch)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor equipment engineering, process engineering, yield improvement, root cause analysis, team management, CAPEX management, global supplier negotiation

Preferred skills

Next-generation process knowledge, fab ramp-up experience, AI-driven process optimization, multinational company experience

Technologies

Ion implantation equipment, diffusion equipment, semiconductor fabrication tools

Responsibilities

Establish mass production technology and launch new equipment, investigate root causes to improve yield and quality, manage resources and develop team members, improve uptime and lead productivity initiatives, negotiate with global teams and suppliers

Seniority

Manager, hands-on leadership

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