Advanced Technology Japan Engineer, CMP process
Core
Developing, optimizing, and stabilizing Chemical Mechanical Polishing (CMP) processes for next-generation semiconductor technologies.
Role type
Senior IC CMP Process Engineer
Builds
High-performance memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Chemical Mechanical Polishing
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP practical experience, semiconductor packaging technology knowledge, DOE/SPC/FMEA methodologies, English technical communication, Microsoft Office proficiency
Preferred skills
3D integration technology experience, LabVIEW/FPGA control, Python/MATLAB data analysis, project leadership, Japanese language proficiency
Technologies
CMP equipment, LabVIEW, FPGA, Python, MATLAB, Microsoft Office
Responsibilities
Develop and optimize CMP processes, evaluate and upgrade new equipment, implement SPC metrics and perform abnormality analysis, reduce risks using FMEA and 8D methodologies, collaborate with global teams and suppliers, drive technology development projects for mass production transition
Seniority
Senior, hands-on IC
