ENGINEER - PD SG CMP
Core
Lead the development, optimization, and transition of Chemical Mechanical Planarization (CMP) processes for advanced 3D NAND technologies from research to high-volume manufacturing.
Role type
Process Development Engineer (CMP)
Builds
Advanced 3D NAND memory solutions
Domain
Semiconductor manufacturing / Memory and storage technologies
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Chemical Mechanical Planarization (CMP) process development, process characterization and optimization, Design of Experiments (DOE), yield and quality improvement, troubleshooting manufacturing issues, process control and monitoring strategies, technology transfer to manufacturing, evaluation of consumables and hardware, patent and technical paper development
Preferred skills
Memory and storage technology experience, advanced engineering tools and software proficiency, competitive industry experience
Technologies
CMP equipment, advanced engineering software, DOE tools
Responsibilities
Lead the development of CMP processes for advanced 3D NAND technologies, Characterize, optimize, and qualify CMP processes for future memory nodes, Transfer new processes into manufacturing and drive continuous improvements in yield, quality, cost, and efficiency, Troubleshoot process and manufacturing issues, Build and complete experiments (DOE) to improve process capability and manufacturability, Evaluate new consumables, hardware, and process technologies for future applications
Seniority
Mid-level IC Engineer
