Staff/Principal Engineer - CMP Advanced NAND
Core
Develop and optimize chemical mechanical planarization (CMP) procedures for next-generation 3D NAND memory parts to improve product quality, reliability, and yield.
Role type
Staff/Principal Engineer, CMP Process Development
Builds
Next-generation 3D NAND memory nodes and systems
Domain
Semiconductor manufacturing, 300mm wafer fabrication, memory technology
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP equipment operation (AMAT, EBARA), optical metrology, profilometry, polishing slurries/conditioners/pads, dielectrics/metals CMP process development, 3D NAND integration constraints, process roadmap definition, multi-functional project leadership, vendor collaboration, AI-driven workflow optimization
Preferred skills
General process flow knowledge for planar/vertical NAND, data science and modeling expertise
Technologies
AMAT (LKP), EBARA-300X, 300mm wafer fabrication tools
Responsibilities
Develop and optimize CMP procedures for next-gen memory parts; manage experiments to widen process margins and evaluate manufacturability; collaborate with vendors on integration requirements; design advanced process monitoring and control methodologies; provide strategic roadmaps for future NAND nodes; mentor new hires on CMP fundamentals; lead complex multi-disciplinary projects in quality, yield, cost, and productivity improvement; leverage AI to streamline workflows and support innovation
Seniority
Staff/Principal, hands-on IC with strategic direction and mentorship
