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MGR, MTTN CMP Process and Equipment

Tainan, Taiwan💼 Full-time🗓 2026-06-24 → 2026-07-31

Core

Drive CMP module performance in a high-volume semiconductor manufacturing environment, owning both process and equipment performance to achieve yield, defectivity, productivity, and cost targets.

Role type

Senior engineering leader (CMP Process and Equipment)

Builds

High-volume memory and storage solutions (DRAM, NAND, NOR)

Domain

Semiconductor manufacturing / Chemical Mechanical Polishing (CMP)

Deliverable

production ML models | product features | dashboards & analysis | infrastructure

Required skills

CMP process optimization, equipment performance management, yield improvement, defectivity reduction, productivity enhancement, cost management, AI-enabled engineering decision-making, workflow automation, problem-solving

Preferred skills

AI tool adoption for engineering, automation of workflows

Technologies

AI tools, automation frameworks

Responsibilities

Achieve yield, defectivity, productivity, and cost targets; adopt AI-enabled ways of working to enhance engineering decision-making; automate workflows; accelerate problem-solving

Seniority

Manager, hands-on engineering leader

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