New College Grad - Product Yield Enhancement Engineer, HBM
Core
Analyze failures from production test, qualification, and customer returns using electrical, physical, and data-driven techniques to identify root causes in HBM fabrication and assembly.
Role type
New College Grad Product Yield Enhancement Engineer (Failure Analysis)
Builds
Next-generation High Bandwidth Memory (HBM) products
Domain
Semiconductor manufacturing (HBM, CMOS/FinFET)
Deliverable
production ML models | product features | dashboards & analysis | client delivery | infrastructure | physical/clinical work
Required skills
Electrical failure analysis, physical failure analysis (PFA), de-processing, CAD (layout/schematic), semiconductor device physics, VLSI design, UNIX/Linux scripting (Tcl/Bash/Shell), data modeling
Preferred skills
Fault isolation, semiconductor packaging knowledge, reliability engineering, AI-assisted analytics
Technologies
Emission microscopy, laser-based methods, EOTPR, AI-assisted tools
Responsibilities
Perform electrical failure analysis and fault isolation; Analyze and model failure signatures from backend testing and RMA data; Apply PFA and de-processing to isolate defects; Develop technical knowledge of CMOS/FinFET processes; Generate failure analysis reports; Collaborate with cross-functional teams; Apply AI-assisted tools to analyze datasets
Seniority
Entry-level (0-2 years experience)
