SR ENGINEER, APTD PHOTO Process
Core
Drive HBM process development and yield improvement in PHOTO process, supporting advanced package technology research and development.
Role type
Senior Process Engineer (Photolithography)
Builds
HBM memory chips and advanced packaging solutions
Domain
Semiconductor manufacturing, photolithography, advanced packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
photolithography fundamentals, materials characterization, root cause analysis, test structure design, cross-team coordination, technical reporting
Preferred skills
independent thinking, innovation
Technologies
Reticle Tapeout, CD control, overlay metrology, PR coating, exposure, develop flow
Responsibilities
Drive HBM process development and yield improvement; assist advanced package technology research; troubleshoot complex process engineering issues; coordinate mechanical characterization and testing globally; review and present data with recommendations to suppliers
Seniority
Mid-Senior, hands-on IC
