ENGINEER, MTB PQA LAB
Core
Perform laboratory-based physical failure analysis to identify defects in semiconductor assembly, test processes, and upstream wafer fabrication.
Role type
Physical Failure Analysis (PFA) Engineer
Builds
Semiconductor memory and storage products (DRAM, NAND, NOR)
Domain
Semiconductor manufacturing / Failure Analysis
Deliverable
physical/clinical work
Required skills
defect isolation, root cause analysis, operation of advanced FA equipment, sample preparation, cross-functional collaboration
Preferred skills
wafer fabrication experience, semiconductor assembly/packaging/testing experience, failure analysis laboratory experience
Technologies
Hot Spot / Emission Analysis, Hamamatsu PHEMOS, Thermo Fisher ELITE DX, FIB, SEM, 3D X-ray, Optical Microscope, Delayer
Responsibilities
Operate advanced FA equipment and analytical tools, conduct defect isolation and root cause analysis, support cross-functional teams on yield and reliability issues
Seniority
Entry-level to Junior, training provided
