Die Prep Module Engineer (Contract)
Core
Own the performance, capability, and reliability of critical metrology and inspection tools in Intel's manufacturing environment to improve measurement accuracy, process control, and operational efficiency.
Role type
Die Prep Module Engineer (Advanced Metrology)
Builds
Semiconductor packaging manufacturing solutions and equipment performance
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
Equipment troubleshooting, Root cause analysis, SPC, DOE, FMEA, Data analysis, Preventive maintenance, Recipe development, Equipment qualification, Operating procedure development
Preferred skills
High-volume production environment experience, Yield enhancement initiatives, Manufacturing data analytics, Cross-functional collaboration
Technologies
Metrology tools, Inspection equipment, Automation systems, Statistical process control software
Responsibilities
Drive equipment troubleshooting and resolution of hardware/software/automation issues; Improve tool uptime and reliability through preventive maintenance; Utilize SPC, DOE, and FMEA to identify trends and prevent process excursions; Partner with Process Engineering and suppliers to support technology transfers and manufacturing ramps; Develop and optimize metrology recipes; Lead equipment installation, qualification, and capacity expansion projects.
Seniority
Mid-level IC