CareerPlan

Intel Foundry Module Development Engineer – Advanced Wet Etch and Cleans

US, Oregon, HillsboroFull-time$134k–$189k2026-10-16 → 2026-11-10
Hybrid · United States

Core

Develop and scale advanced wet etch, selective removal, and chemical clean processes for next-gen transistor architectures (RibbonFET/GAA) and backside power delivery networks.

Role type

Senior IC process development engineer (wet etch/cleans)

Builds

Novel wet etch and clean processes for 300mm semiconductor manufacturing

Domain

Semiconductor manufacturing / Chemical engineering

Required skills

DOE, wet chemical synthesis, electrochemistry, surface functionalization, thin-film interface phenomena, cleanroom wet bench processing

Preferred skills

Chemical reaction kinetics, selective wet etching, interfacial surface chemistry, corrosion/passivation mechanisms, surfactant-assisted cleaning/drying, thin-film characterization (Ellipsometry, AFM, SEM/TEM, XPS, FTIR, TXRF, ICP-MS), automated fluidic systems, Python/MATLAB/JMP/ML for DOE

Technologies

Python, MATLAB, JMP, CFD, ML frameworks

Responsibilities

Formulate and execute DOE to validate novel wet etch and clean processes; Collaborate with equipment suppliers to co-engineer custom dispense and chamber hardware; Integrate CFD and chemical kinetics modeling to accelerate formulation screening; Translate chemical phenomena into patents and proprietary solutions; Bridge lab prototypes to 300mm fab-scale ramp using Copy Exactly methodology

Seniority

Senior, hands-on IC