Packaging Module Development Engineer
Core
Develop and validate board assembly process solutions for Intel's next-generation CPU, Chipset, and SoC BGA packages and Socket Technology.
Role type
Packaging Module Development Engineer (SMT Process & Materials)
Builds
SMT manufacturing solutions and PCB assembly processes for Intel IC packages and sockets
Domain
Semiconductor manufacturing / Surface Mount Technology (SMT)
Required skills
SMT process development, stencil design, solder paste selection, reflow profiling, failure analysis, root cause analysis, statistical process control (SPC), Design of Experiments (DOE), materials characterization
Preferred skills
Cross-functional collaboration, technology roadmap planning, prototype testing, data analysis
Technologies
X-ray inspection, automated optical inspection (AOI), reflow ovens, pick and place machines, dispensing equipment
Responsibilities
Design and optimize SMT processes including stencil design and reflow profiling; Evaluate and select assembly materials like solder pastes and underfills; Conduct root cause analysis of assembly defects; Develop technology roadmaps for SMT and PCB advancements; Oversee prototype board assembly and testing; Analyze process data to drive continuous improvement
Seniority
Mid-level, hands-on IC
