CareerPlan

Module Development Defect Metrology Engineer

US, Oregon, HillsboroFull-time$156k–$220k2026-10-08 → 2026-11-10
On-site · United States

Core

Develop and optimize cutting-edge manufacturing metrology defect inspection tools for high-volume semiconductor production and packaging.

Role type

Senior IC module development engineer (semiconductor metrology)

Builds

Defect inspection tools and equipment solutions for Intel's advanced packaging and manufacturing

Domain

Semiconductor manufacturing and advanced packaging

Required skills

Semiconductor process development, statistical process control, equipment metrology, system integration, automation optimization, cross-functional collaboration, technology roadmap planning, supplier partnership management

Preferred skills

Metrology for hybrid bonded interconnects, ultra-fine pitch solder connections, RDL-based packaging

Technologies

Semiconductor manufacturing equipment, defect inspection systems, statistical process control tools

Responsibilities

Lead development of advanced manufacturing metrology defect inspection tools; Drive process and hardware development for high-volume manufacturing; Develop and execute technology roadmaps; Partner with equipment and material suppliers; Optimize production efficiency and output; Leverage data analytics to enhance process stability; Recommend equipment modifications for efficiency and scalability

Seniority

Senior, hands-on IC