Assembly Handling Systems Development Engineer
Core
Develop high accuracy and high-speed pick-n-place material handling technology for next-generation semiconductor packaging processes.
Role type
Senior IC hardware/software development engineer (semiconductor packaging handling systems)
Builds
High volume manufacturing equipment and automated material handling solutions for Intel's chip packaging
Domain
Semiconductor manufacturing / Robotics / Automation
Deliverable
production ML models | product features | infrastructure
Required skills
motion control, high accuracy/speed robotic systems, vision systems, semiconductor packaging technology, process recipe development, hardware/software validation
Preferred skills
AMR/AGV systems, conveyor systems, automated storage solutions, kinematics, mechanical design (CAD/Solidworks), statistical process control (SPC), Design of Experiments (DOE)
Technologies
Solidworks, 2D vision systems, CAD
Responsibilities
Develop handling process recipes and validate nozzle tooling; Test and validate hardware/software upgrades; Solve process/equipment issues on the manufacturing floor; Drive improvements in quality, yield, and productivity; Apply engineering principles to develop novel design solutions for high volume manufacturing
Seniority
Experienced Hire, hands-on IC