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Module Development Engineer

US, Oregon, Hillsboro💼 Full-time💰 $115,110–$115,110🗓 2026-09-24 → 2026-09-25

Core

Lead the design and optimization of complex semiconductor manufacturing processes, including material selection and equipment development, to enable high-volume production.

Role type

Module Development Engineer (Semiconductor Manufacturing)

Builds

Semiconductor manufacturing processes and equipment solutions for Intel Foundry

Domain

Semiconductor manufacturing / Materials Science / Mechanical Engineering

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor process development, Cleanroom operations, Statistical Process Control (SPC), Design of Experiments (DOE), Wafer-level assembly module engineering, Equipment metrology, Parameter optimization, Roadmap development for future technologies, Supplier collaboration, Equipment modification and efficiency improvement

Preferred skills

Semiconductor packaging and assembly technologies, Advanced process control systems, JMP software, Structured problem-solving methods

Technologies

JMP, MHS equipment

Responsibilities

Lead development of manufacturing processes including MHS equipment development and parameter optimization; Perform pathfinding activities for emerging device architectures; Develop roadmaps for future technologies; Collaborate with equipment and materials suppliers; Recommend and execute modifications to equipment and processes; Stay informed about industry trends in materials and manufacturing processes

Seniority

Mid-Senior level (3+ years experience with Bachelor's, 2+ with Master's)

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