Quantum Packaging Thermal Architect
Core
Thermal modeling and simulation of silicon quantum dot packaging solutions, from redistribution layers to IC substrates, to manage heat flow and enable co-design of scalable quantum systems.
Role type
Senior IC thermal packaging modeling engineer (quantum computing)
Builds
Silicon-based quantum processors and scalable quantum systems
Domain
Semiconductor manufacturing / Quantum computing / Cryogenic thermal engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Thermal modeling and simulation, Packaging hardware integration, Mechanical design collaboration, Simulation software proficiency (Ansys Icepak, COMSOL), Thermal/mechanical optimization, Cryogenic packaging knowledge
Preferred skills
Cryogenic packaging modeling, Advanced thermal integration strategies
Technologies
Ansys Icepak, COMSOL
Responsibilities
Perform thermal modeling and simulation of packaging hardware to analyze heat flow from silicon test chips through heat spreaders; Manage integration of packaging hardware and facilitate co-design with stakeholders; Collaborate with mechanical designers to define heat spreaders for optimal performance; Deliver design milestones and documentation to stakeholders; Stay current on packaging technology developments through conferences and literature review
Seniority
Senior, hands-on IC
