Module Development Engineer - LTD Dry Etch
Core
Develop and optimize dry etch processes for next-generation semiconductor patterning and high-volume manufacturing.
Role type
Senior IC process development engineer (dry etch)
Builds
Advanced logic device architectures and high-volume manufacturing solutions
Domain
Semiconductor manufacturing / Dry etch / Process Integration
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Dry etch process development, Plasma etch fundamentals, DOE and statistical analysis, Equipment modification, Yield and reliability improvement, Cross-functional technical leadership
Preferred skills
Advanced dry etch technologies (ICP/CCP, HARC, ALE), Defectivity and variability reduction, Materials characterization (SEM, TEM, AFM, XPS), APC development
Technologies
JMP, Python, MATLAB, SPC systems, CD SEM, AFM, XPS
Responsibilities
Drive technology development for future nodes and high-volume manufacturing; Own development of next-generation patterning processes and qualification methodologies; Perform pathfinding activities on existing and first-of-kind equipment; Provide technical leadership for cross-functional problem solving and root cause analysis; Design and execute comprehensive characterization plans and experiments; Establish control systems to optimize production performance; Drive improvements in yield, reliability, cost, and productivity; Mentor engineers and communicate status to stakeholders; Partner with equipment suppliers to develop enabling technology elements.
Seniority
Senior, hands-on IC