WPM-NM Die Pick Module Equipment Contract Technician
Core
Maintain, troubleshoot, and improve semiconductor wafer packaging manufacturing equipment performance in a cleanroom environment.
Role type
Equipment Contract Technician (Semiconductor Manufacturing)
Builds
Semiconductor wafer packaging modules and tools for advanced packaging and AI computing
Domain
Semiconductor manufacturing / Advanced packaging
Required skills
electrical troubleshooting, mechanical troubleshooting, equipment calibration, preventative maintenance, blueprint reading, data analysis, cleanroom procedures, PPE usage, ladder climbing, heavy lifting
Preferred skills
semiconductor equipment maintenance, hand tools proficiency, electrical meters, calibration tools
Technologies
layout plans, blueprints, operating manuals, technical documentation, Microsoft Office
Responsibilities
Perform electrical and mechanical troubleshooting to diagnose equipment issues; dismantle, adjust, repair, install, and assemble equipment; execute setup, calibration, and preventative maintenance; monitor and analyze equipment performance data; document system failures and update specifications; partner with engineering for experiments and configuration changes; support factory ramp-up and tool qualification; maintain safety and quality standards.
Seniority
Mid-level, hands-on IC