WPM-NM Die Pick Module Equipment Contract Technician
Core
Maintain, troubleshoot, and improve manufacturing equipment performance in semiconductor wafer processing and die-to-wafer assembly.
Role type
Equipment Contract Technician (Semiconductor Manufacturing)
Builds
Semiconductor packaging tools and modules for AI computing and next-generation technologies
Domain
Semiconductor manufacturing / Advanced packaging
Deliverable
physical/clinical work
Required skills
electrical troubleshooting, mechanical troubleshooting, equipment assembly and repair, calibration, preventative maintenance, data analysis, blueprint reading, cleanroom operations, ladder climbing, heavy lifting
Preferred skills
semiconductor equipment maintenance, proficiency with hand tools, electrical meters, and calibration tools
Technologies
layout plans, blueprints, operating manuals, technical documentation
Responsibilities
diagnose non-functioning manufacturing equipment, dismantle/adjust/repair/install/assemble equipment, execute setup and calibration, monitor and analyze performance data, document system failures, partner with engineering for experiments and configuration changes, support factory ramp-up tool installation and qualification
Seniority
Mid-level, hands-on IC