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Senior Module Development Engineer

US, Oregon, Hillsboro💼 Full-time🗓 2026-09-02 → 2026-10-01

Core

Senior Module Development Engineer leading metrology equipment qualification, process development, and technology roadmap strategy for advanced semiconductor packaging.

Role type

Senior IC Module Development Engineer (Metrology)

Builds

Next-generation metrology equipment capabilities, process integration solutions, and technology roadmaps for advanced packaging programs.

Domain

Semiconductor manufacturing / Advanced Packaging / Metrology

Required skills

Semiconductor process development, Statistical Process Control (SPC), Metrology equipment qualification, Process feasibility studies, Equipment configuration, Recipe development, SPC strategy, Cross-functional program leadership, Vendor co-development, Python scripting

Preferred skills

Advanced packaging process experience, Equipment automation development, Data analysis tools, Project management, AI/ML process control integration

Technologies

Python, Dashboard Creation tools, Metrology equipment platforms

Responsibilities

Lead end-to-end qualification of new metrology equipment from installation to fab readiness; Define long-range technology roadmap for metrology capabilities; Drive technology development and enablement for high-volume manufacturing and future nodes; Conduct process technology feasibility studies via simulation and engineering methods; Serve as primary technical resource for fab support and process excursion resolution; Partner with equipment vendors to co-shape next-generation tool capabilities; Lead metrology module development across concurrent advanced packaging programs; Design rapid inline feedback mechanisms for accelerated learning cycles.

Seniority

Senior, hands-on IC with strategic roadmap ownership

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