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RAM Applications Lead Engineer

Taichung - Fab 16, Taiwan🌐 Remote💼 Full-time🗓 2026-06-26 → 2026-07-30

Core

Lead measurement and inspection strategy for high-volume semiconductor manufacturing, focusing on metrology and inline optical inspection (RDA) to ensure data quality and process control.

Role type

Lead Metrology & RDA Applications Engineer

Builds

Production-ready metrology recipes, RDA inspection applications, and statistical process control (SPC) methods for wafer fabrication.

Domain

Semiconductor manufacturing (memory and storage solutions)

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Semiconductor metrology and inspection (RDA), recipe development and validation, statistical process control (SPC), data analysis and visualization, cross-functional technical leadership, process anomaly detection and containment, tool matching and reference validation

Preferred skills

MS or PhD in relevant technical discipline, experience with e-beam, optical, and x-ray metrology systems, experience with eScan, Brightfield, Darkfield, Macro, and SP inspection platforms, driving standardization across global sites, partnering with equipment vendors

Technologies

JMP, Spotfire, Tableau, e-beam systems, optical metrology, x-ray methods, eScan, Brightfield, Darkfield, Macro, SP platforms

Responsibilities

Provide technical leadership for metrology and RDA strategy and readiness; develop and sustain metrology and RDA recipes; establish and improve SPC methods and monitor plans; lead cross-functional execution for production support and ramp activities; mentor engineers and technicians; drive continuous improvement to reduce defectivity and improve yield.

Seniority

Senior, hands-on IC with leadership responsibilities

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