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Thin Films Module Development Engineer

US, Oregon, Hillsboro💼 Full-time💰 $133,800–$188,890🗓 2026-08-21 → 2026-09-26

Core

Deliver metals process definition, development, and optimization in metal deposition modules for high-k/metal gate, contact, and interconnect applications.

Role type

Thin Films Module Development Engineer (Process Development)

Builds

Advanced semiconductor process modules for next-generation technologies

Domain

Semiconductor manufacturing / Thin film deposition

Deliverable

production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work

Required skills

Thin film deposition technologies (ALD, CVD, PVD, electrochemical deposition), statistical data analysis, experimental design, materials characterization, metrology, device characteristics, data analysis software (JMP, Python, R, SQL)

Preferred skills

High-k/metal gate stack development, Cu interconnect barrier/liner/plating, MOSFET/FinFET/GAA/CFET device fundamentals, AI-assisted engineering tools

Technologies

ALD, CVD, PVD, sputtering, evaporation, XRF, XPS, XRD, SEM, TEM, ellipsometry, e-test

Responsibilities

Own thin film metal deposition process development across multiple platforms; Design, implement, and optimize processes to meet specifications; Execute experiments to support yield improvement; Support novel material and process screening; Partner with cross-functional teams; Contribute to process pathfinding for next-generation technologies

Seniority

Mid-level, hands-on IC

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