Process and Equipment Engineer
Core
Optimize high-volume semiconductor manufacturing processes and equipment to ensure quality, efficiency, and output in device miniaturization.
Role type
Senior IC process and equipment engineer (semiconductor assembly)
Builds
High-volume semiconductor chips and modules
Domain
Semiconductor manufacturing / Materials Engineering
Required skills
Semiconductor assembly processes (die attach/TCB, flip-chip), Cu pillar/microbump metallurgy, statistical process control (SPC), metrology analytics (X-ray, AOI, microscopy), cleanroom operations, equipment maintenance and qualification
Preferred skills
Cross-functional collaboration, continuous improvement leadership, data-driven problem-solving
Technologies
X-ray inspection, warpage measurement, optical inspection (AOI), microscopy
Responsibilities
Own and optimize manufacturing equipment and processes; Conduct tests to maintain control over critical dimensions and defectivity; Recommend and implement modifications to improve equipment performance; Collaborate globally to transfer technology and ensure processing consistency; Execute maintenance and repair activities for equipment and module components; Drive continuous improvement initiatives for safety, quality, and yield metrics; Manage equipment install, conversion, and qualification during factory ramps
Seniority
Senior, hands-on IC
