Module Development Engineer (Adv Packaging)
Core
Drive semiconductor technology development and manufacturing enablement for high-volume and next-generation technologies, focusing on process integration and equipment solutions.
Role type
Module Development Engineer (Advanced Packaging)
Builds
Advanced packaging solutions and semiconductor manufacturing processes for foundry customers
Domain
Semiconductor manufacturing / Advanced Packaging
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Statistical Process Control (SPC), Design of Experiments (DOE), process integration, equipment solutions, feasibility studies, pathfinding, technology roadmaps, supplier collaboration, process qualification
Preferred skills
Semiconductor technology development, complex project delivery, semiconductor fabrication processes, foundry environment experience
Technologies
SPC, DOE, metrology, system design, simulation tools
Responsibilities
Develop process integration and equipment solutions to meet device performance and manufacturability requirements; Lead the design and development of advanced manufacturing processes including material selection and parameter optimization; Perform process technology feasibility studies using engineering analysis and experimental methods; Conduct pathfinding activities to support hardware and process development for emerging device architectures; Develop technology roadmaps that support future manufacturing and product requirements; Identify and implement process and equipment improvements to increase production efficiency and output
Seniority
Mid-level, hands-on IC
