Hardened Microelectronics Science & Technology Lead
Core
Lead Science & Technology efforts for Hardened Microelectronics (HME), aligning engineering technology development with corporate strategy and business offices.
Role type
Senior IC Hardened Microelectronics Science & Technology Lead
Builds
Advanced ASICs, 3D/HI packaging, embedded cyber-physical security, anti-tamper, and radiation-hardened designs for extreme environments
Domain
Defense, Space Exploration, Microelectronics
Deliverable
production ML models | product features | infrastructure
Required skills
Integrated Circuit (IC) architecture design, Custom IC/ASIC/SoC design, Transistor-level circuit design and simulation, System-level design, Hardware optimization (performance/power/cost), Verification and debugging, Technical strategy development, Program capture and execution oversight, Team mentorship
Preferred skills
PhD in relevant engineering discipline, Experience leading diverse engineering teams, Government S&T agency engagement (DARPA, ONR, AFRL, IARPA, ARL), Product development leadership
Technologies
ASIC, SoC, 3D/HI packaging, Cyber-physical security, Radiation hardening
Responsibilities
Specify and validate IC architecture and define requirements for custom ICs, ASICs, and SoCs; Design and simulate circuits at transistor-level; Mentor individuals and teams on design and implementation; Optimize hardware designs for performance, power, and cost; Evaluate hardware feasibility of complex algorithms; Perform verification and debugging; Guide designs through the entire product cycle; Document all phases of chip development; Lead the Hardened Microelectronics IR&D portfolio; Support business offices in shaping and capturing new S&T business opportunities; Develop strategic relationships with DOD HMT leaders
Seniority
Senior, hands-on IC with strategic oversight
