SiPh Package Reliability Engineer
Core
Develop reliability methodology and execute qualification for silicon photonics products and advanced optical packages, evaluating risks across chip-to-package, fiber-to-chip, and material interfaces.
Role type
Package Reliability Engineer
Builds
Qualification plans, reliability evidence packages, and failure analysis reports for silicon photonics and optical packages.
Domain
Semiconductor manufacturing / Silicon Photonics / Optical Packaging
Required skills
Reliability physics, accelerated testing, failure mechanism identification, Weibull/lognormal analysis, experiment design, risk assessment, cross-functional collaboration
Preferred skills
Silicon photonics components knowledge, advanced optical packaging, co-packaged optics, finite element analysis, failure analysis techniques (cross-sectioning, microscopy, X-ray), statistical tools (JMP, Minitab, Python, R, MATLAB)
Technologies
JMP, Minitab, Python, R, MATLAB, X-ray, CT, SAM, spectroscopy
Responsibilities
Define qualification requirements and test plans; execute reliability evaluations (thermal cycling, humidity, mechanical stress); correlate characterization data to determine failure drivers; support failure analysis and root-cause investigations; provide reliability design guidance during architecture and material selection; analyze reliability data using statistical methods; author qualification reports and technical specifications.
Seniority
Mid-to-Senior, hands-on IC
