Principal Engineer Process Engineering (CMP)
Core
Develop and optimize CMP (Chemical Mechanical Planarization) process formulations, methods, and controls for 300mm advanced packaging to meet quality standards and technology specifications.
Role type
Senior IC process engineer (CMP)
Builds
300mm advanced packaging modules and process capabilities
Domain
Semiconductor manufacturing / Chemical Mechanical Planarization
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
process formulation, SOP development, FMEA, equipment integration, continuous improvement, technical chart analysis, cross-functional collaboration
Preferred skills
null
Technologies
null
Responsibilities
Create, analyze, and review technical charts; Develop and modify process formulations, methods, and controls to meet quality standards; Establish SOP (Standard operating process) and FMEA (Failure mode and effects analysis) for related process; Review product development requirements for compatibility with processing methods to determine costs and schedules; Integrates equipment and material capabilities to meet process module and technology specifications; Drive CIP (Continuous improvement plans) to improve process performance indices
Seniority
Senior, hands-on IC