Quantum Assembly Engineer
Core
Drive development and integration of cryogenic, superconducting assembly processes for scalable quantum hardware packaging.
Role type
R&D assembly engineer (quantum packaging)
Builds
Cryogenic-compatible assembly processes for 2D, 2.5D, and 3D quantum packaging platforms
Domain
Semiconductor manufacturing / Quantum computing / Cryogenics
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
BEOL processes and integration, bump/wafer finish integration, wafer test/probe, OSAT collaboration, package development & assembly, design of experiment, failure analysis, root-cause investigation, cryogenic reliability testing, RF/microwave integrity validation, high-precision alignment tooling definition
Preferred skills
PhD level education, project management, innovation in ambiguous environments, technical leadership
Technologies
Flip-chip, micro-bump, superconducting bump attach, Die-to-wafer (D2W), wafer-to-wafer (W2W), hybrid bonding, dilution refrigerators, indium, superconducting metals, underfills
Responsibilities
Lead development of cryogenic-compatible assembly processes; Define assembly schemes for flip-chip, micro-bump, and hybrid bonding; Optimize processes for low-loss signal paths and mechanical integrity; Own assembly integration flows from incoming wafer/die through package build; Lead failure analysis and root-cause investigations; Support hardware bring-up and validation in cryogenic environments; Evaluate and select assembly materials and interfaces for cryogenic operation; Interface with OSATs and suppliers to scale assembly processes; Contribute to quantum packaging roadmap and capability build-out
Seniority
Senior, hands-on IC
