Quantum Advanced Packaging Manager
Core
Leading the Quantum advanced packaging team to develop cryogenic and superconducting capabilities including wafer-to-wafer and die-to-wafer hybrid bonding and interposers.
Role type
Manager, Quantum Advanced Packaging
Builds
Cryogenic/superconducting packaging solutions (W2W/D2W hybrid bonding, interposers)
Domain
Semiconductor manufacturing / Quantum computing hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Team leadership, project execution, budget management, strategic partnership development, roadmap planning, cross-functional collaboration
Preferred skills
PhD in relevant engineering field, advanced people management, innovation in ambiguous environments
Technologies
Wafer-to-wafer bonding, Die-to-wafer bonding, Interposers, Cryogenic systems
Responsibilities
Lead and develop the Quantum Advanced Packaging team, Manage hiring and capability building, Oversee project execution and delivery, Drive program planning and stakeholder updates, Define and scope development programs, Manage budgets and resource allocation, Establish strategic partnerships with vendors, Execute the advanced packaging roadmap, Report on team performance to senior management
Seniority
Manager, technical lead & people management
