Principal Engineer (CMP Module)
Core
Develop, optimize, and sustain Chemical Mechanical Planarization (CMP) processes for semiconductor fabrication technology nodes.
Role type
Principal Engineer (CMP Module)
Builds
Advanced planarization solutions for integrated circuits
Domain
Semiconductor manufacturing / Wafer fabrication
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
CMP process formulation, tool control, data analysis for non-uniformity/defectivity/removal rate, SOP development, FMEA, recipe creation, metrology tool optimization, continuous improvement planning, cross-functional collaboration, technical mentorship, complex problem solving, patent writing, conference publication
Preferred skills
None stated
Technologies
CMP equipment, metrology tools (film thickness measurement, surface inspection), SPC, DOE, FMEA
Responsibilities
Develop and modify CMP process formulations and tool controls; Analyze technical data to ensure CMP performance metrics; Establish and maintain SOPs and FMEA; Integrate CMP equipment and material systems; Lead recipe creation and optimization for CMP metrology tools; Drive Continuous Improvement Plans (CIPs); Serve as technical subject matter expert providing guidance and training; Solve complex, novel technical problems; Contribute to intellectual property via patents; Participate in conference or journal publications
Seniority
Principal, hands-on IC with strategic leadership
