Principal Infrastructure Researcher – 3D Integration
Core
Define, develop, and realize infrastructure for advanced hybrid bonding research impacting future lithography tool requirements.
Role type
Principal Infrastructure Researcher (Semiconductor)
Builds
Bonding research facilities, laboratory capabilities, and demonstrator environments for lithography tool development.
Domain
Semiconductor manufacturing / Lithography / Advanced Packaging
Required skills
Semiconductor process development, thin film processing, advanced packaging, wafer bonding, 3D integration, complex laboratory infrastructure deployment, technology roadmap planning, equipment selection and integration, external partner management, technical strategy, stakeholder communication
Preferred skills
Experience with research institutes, suppliers, and multidisciplinary development teams, spatial high frequency field action knowledge (DUV/EUV)
Technologies
DUV, EUV, hybrid bonding, CMP, plasma activation, wafer handling
Responsibilities
Define infrastructure roadmap and translate technology requirements into equipment specifications; Lead realization of bonding research facilities and process equipment; Coordinate equipment procurement, installation, and qualification; Manage external technology partners and suppliers; Contribute to technical direction of scanner platforms; Balance infrastructure investments against program objectives.
Seniority
Principal, strategy & mentorship (via careerplan.io/jobs/J-00354539-principal-infrastructure-researcher-3d-integration-at-asml)