Advanced SMT Process Development Engineer
Core
Senior technical expert for advanced SMT and board-assembly process development on high-complexity computing platforms, defining assembly strategies and making complex PCB assemblies manufacturable.
Role type
Senior IC manufacturing process engineer (SMT/PCB assembly)
Builds
High-complexity PCB assemblies with large BGA packages for computing platforms
Domain
Semiconductor manufacturing / PCB assembly
Required skills
SMT process development, large BGA assembly, warpage/coplanarity management, solder defect reduction, edge bonding/underfill strategies, DFM reviews, DOE and root-cause analysis, EMS partner management
Preferred skills
Experience with high-warpage BGAs (>70 mm), statistical analysis (Minitab/JMP), IPC/J-STD standards, PCB CAD tools (Mentor Graphics/Cadence)
Technologies
SMT equipment, X-ray, C-SAM, Shadow Moiré, DIC, vacuum reflow, inert-atmosphere reflow
Responsibilities
Lead end-to-end SMT process development and define robust process windows; Own assembly of large, high-warpage BGA packages and develop design rules; Reduce solder defects through stencil design and reflow optimization; Define and qualify edge bonding and underfill strategies; Evaluate mechanical stress transfer and ensure repeatable rework processes; Lead DFM reviews and author board-assembly guidelines; Run DOEs and root-cause analysis for yield and reliability issues; Work with contract manufacturers to qualify capability.
Seniority
Senior, hands-on IC
