Principal Mechanical Engineer
Core
Lead the development of advanced package-board-system mechanical solutions for next-generation high-performance computing, AI, and semiconductor products, spanning concept definition through manufacturing ramp.
Role type
Principal Mechanical Engineer (IC with technical leadership)
Builds
Advanced semiconductor packaging, server, and rack system mechanical solutions
Domain
Semiconductor / High-Performance Computing / Thermal Management
Required skills
Thermal-mechanical architecture, FEA simulation, CAD design, stress/warpage analysis, DFM/DFX, failure analysis, supplier management, cross-functional leadership
Preferred skills
Advanced cooling solution design (heatsinks, vapor chambers, liquid cold plates), manufacturing process expertise (machining, brazing, soldering), OSAT/foundry collaboration, thermo-mechanical reliability correlation
Technologies
Creo, SolidWorks, ANSYS Mechanical, DIC, shadow moiré, strain gauges, thermal cycling equipment
Responsibilities
Lead thermal-mechanical architecture and solution strategy; drive thermo-mechanical design and analysis; guide stress, warpage, and reliability modeling; partner with silicon, packaging, and manufacturing teams; drive DFM, tolerance analysis, and ECO governance; conduct qualification and failure analysis; establish mechanical specifications and design guidelines
Seniority
Principal, hands-on IC with strategic influence
