Advanced Package Thermal Technologist
Core
Package-centric Thermal Modeling Architect defining next-generation packaging-platform architectures through model-based decision making and System-Technology Co-Optimization (STCO) for data center and high-performance computing systems.
Role type
Senior IC thermal modeling architect
Builds
Next-gen packaging-platform architectures and cooling solutions for data center and HPC systems
Domain
Semiconductor packaging, thermal management, and high-performance computing
Deliverable
production ML models
Required skills
Thermal modeling, multi-physics modeling (thermo-mechanical, electro-thermal, electro-optical), CFD, SoC/package/board-level design, experimental validation, technology readiness assessment, roadmap influence
Preferred skills
AI/ML-based engineering workflows (surrogate modeling, automated optimization), advanced PCB technologies, SMT process influence, DOE design, lab collaboration
Technologies
CFD, thermal modeling tools, electro-optical integration tools
Responsibilities
Drive model-based architecture and design decisions for advanced package technologies; Develop and maintain thermal and multi-physics models and drive validation strategies; Engage with suppliers to align material properties and process capabilities; Define targets and strategic direction for thermal and package technology development; Serve as thermal subject-matter expert for SoC, package and system-level architectures
Seniority
Senior, hands-on IC