Senior Director, Board Product Development Engineering
Core
Design, implement, and institutionalize the integration readiness process for all next-generation datacenter board products, owning manufacturing and test readiness end to end.
Role type
Senior Director, Board Product Development Engineering (IC)
Builds
Next-generation datacenter boards (AI platforms) and manufacturing/test processes
Domain
Semiconductor manufacturing, high-complexity electronics, datacenter hardware
Required skills
Cross-domain integration management, DFM (Design for Manufacturing), high-speed signal integrity, board-level reliability, yield optimization, global team leadership, supplier qualification (ODM/CM/OSAT), executive communication
Preferred skills
MS or PhD in EE/Materials Science, experience with 112G/224G SerDes, 2.5D/3D packaging, fine-pitch BGA, next-gen interconnects
Technologies
PCB fabrication, SMT/PCBA, flip-chip BGA, high-speed connectors, BERT, channel margining, diagnostic boards
Responsibilities
Design and implement integration readiness processes for board products; Guide functional teams in developing cross-boundary techniques before silicon freeze; Build and lead a global Board PDE organization across PCB, SMT, and Signal Integrity pillars; Set up integration oversight throughout the chip-to-board stack; Collaborate with Operations Test Engineering to establish test coverage; Take charge of reliability and yield performance throughout the stack; Support manufacturing partners in producing world-class datacenter products
Seniority
Senior Director, global leadership
