Sr. Manager Packaging Engineering
Core
Lead end-to-end execution of next-generation Data Center GPU and MI package design programs, delivering high-performance, high-complexity package solutions.
Role type
Senior Manager, Packaging Engineering
Builds
High-performance semiconductor packages for Data Center GPUs and MI (Machine Intelligence) products
Domain
Semiconductor / Advanced Packaging / Data Center
Deliverable
production ML models
Required skills
Program management, Team leadership, Cross-functional collaboration, Risk management, Design convergence, Vendor management, Process innovation, AI/ML tool adoption, High-speed design knowledge, Multi-die integration
Preferred skills
Data Center GPU experience, OSAT/substrate vendor engagement, Synopsys 3DICC, Cadence SiP/APD, Chiplet/2.5D/3D integration, HPC experience
