Associate Optical Packaging Engineer
Core
Building fiber-coupled optical packages with photonic chips and driving hands-on engineering validations for process development.
Role type
Associate Optical Packaging Engineer
Builds
Fiber-to-chip packaged chip assemblies and optical module packaging
Domain
Silicon photonics and quantum computing hardware
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Optical alignment, fiber optics, optical measurement techniques, semiconductor assembly, precision alignment systems, automated manufacturing equipment, hands-on laboratory experience, metrology tools
Preferred skills
Photonic integrated circuit (PIC) packaging, optical module assembly, data analysis tools (Excel, JMP, MATLAB, Python), statistical process control (SPC), DOE, yield analysis
Technologies
Fiber optics, photonic chips, automated manufacturing equipment, metrology tools
Responsibilities
Support hand-on manufacturing of fiber-to-chip packaged chip assemblies, develop and optimize optical packaging and active alignment processes, execute experiments to improve optical coupling efficiency and assembly yield, support NPI activities, troubleshoot manufacturing and reliability issues, develop process documentation, collaborate with cross-functional teams, support equipment setup and calibration, evaluate materials and tooling with vendors, analyze process and metrology data
Seniority
Associate, hands-on IC