NPI Senior Process Engineer
Core
Develop, optimize, and qualify assembly processes (Resin Tie Bar Cut, Strip Grinding, Cut Form Mark) for new REXFET semiconductor products to ensure manufacturing readiness.
Role type
Senior IC NPI Process Engineer (Semiconductor Assembly)
Builds
New REXFET product assembly processes and qualification builds
Domain
Semiconductor manufacturing / Power discrete packaging
Required skills
Semiconductor assembly process development, DOE, SPC, process capability analysis, FMEA, root cause analysis, technical reporting, cross-functional collaboration
Preferred skills
Power semiconductor packaging experience, JMP analysis tools, machine vision inspection, dieset maintenance, process transfer, mass production ramp-up
Technologies
JMP, Microsoft Excel, Microsoft PowerPoint
Responsibilities
Develop and optimize assembly process conditions for new products, execute process validation activities, establish process parameters and control limits, collaborate with cross-functional teams for product introduction, prepare process documentation and SOPs, support troubleshooting and production ramp-up
Seniority
Senior, hands-on IC
