CareerPlan

Equipment Development Engineer, Laser Alignment & Photonic Packaging

Shenzhen, Guangdong Province, cnFull-time2026-10-30 → 2026-11-11

Core

Design and develop precision equipment, mechanisms, fixtures, and subsystems for laser alignment, optical attachment, photonic packaging, testing, and automation applications.

Role type

Senior IC equipment development engineer (opto-mechanical)

Builds

Precision equipment for semiconductor and photonics assembly and testing

Domain

Semiconductor manufacturing / Photonics / Opto-mechanical systems

Required skills

Precision opto-mechanical system design, Tolerance analysis, GD&T, 3D modeling (SolidWorks), System integration, Root cause analysis, Engineering validation, Motion control, Manufacturing process knowledge

Preferred skills

Active Optical Alignment, Laser Attach/Die Attach, Optical Module Assembly, Silicon Photonics, Photonic Packaging, Precision Motion Control, Machine Vision, Semiconductor Assembly Equipment