半導体組み立て工程 ワイヤボンディング開発エンジニア
Core
Establish wire bond conditions and develop technology for new semiconductor products, supporting mass production transition and yield improvement.
Role type
Semiconductor assembly process development engineer (wire bonding)
Builds
Semiconductor packages and components for automotive, industrial, infrastructure, and IoT applications
Domain
Semiconductor manufacturing (back-end processes)
Required skills
Wire bonding technology, reliability testing fundamentals, semiconductor back-end process knowledge, technical degree (mechanical/materials/electronics/chemistry)
Preferred skills
Semiconductor packaging material development, process technology establishment, wire bonding defect improvement, CAD drawing creation
Technologies
Wire bonding equipment, CAD tools
Responsibilities
Establish wire bond conditions for new products, support project development and reporting, prepare specifications for mass production transition, improve product quality and yield, develop technology for new materials and processes, collaborate with overseas sites
