CareerPlan

Assembly Process Manufacturing Engineer for Back End Fab

Nakatsu, jpFull-time2026-10-21 → 2026-11-12

Core

Launching assembly process production technology for high-quality automotive SOC products and AI-related power module lines.

Role type

Semiconductor back-end process engineer

Builds

Automotive SOC and AI-related power module assembly lines

Domain

Semiconductor manufacturing (automotive, AI)

Required skills

Semiconductor back-end process engineering, Package sealing, Stamping, PKG dicing

Preferred skills

Full semiconductor assembly process knowledge, Image processing inspection technology, Statistics, Quality control

Technologies

Semiconductor assembly equipment, Inspection systems

Responsibilities

Improve productivity, quality, and yield of automotive SOC; Launch newly developed AI-related power module assembly line

Seniority

Mid-level, hands-on IC