Principal Digital Design Engineer
Core
Architect, design, and implement digital and mixed-signal integrated circuits (ICs) for automotive, industrial, and IoT applications, leading development from conception to production release.
Role type
Principal Digital Design Engineer (Mixed-Signal IC)
Builds
Digital and mixed-signal System-on-Chip (SoC) products
Domain
Semiconductor / IC Design / Automotive & Industrial IoT
Deliverable
production ML models | product features
Required skills
SOC architecture, AHB/APB/AXI bus protocols, embedded memory design, RTL coding, simulation, synthesis, DFT, timing check, mixed-signal chip development
Preferred skills
DDR DRAM and Flash memory knowledge, project management, AI integration in daily workflows
Technologies
USB, I2C/I3C, SPI, UART, SRAM, OTP, MTP, EE/Flash
Responsibilities
Define chip architecture and partitioning, lead development teams across US and China sites, perform circuit debugging and silicon evaluation, develop production test strategies, specify technology requirements for future products
Seniority
Principal, hands-on IC architect with strategic oversight
