Manufacturing Engineer
Core
Provide full support to achieve organizational objectives by ensuring machine stability, supporting production and new product development, and managing cost investments for semiconductor manufacturing equipment.
Role type
Manufacturing Engineer (Semiconductor Assembly)
Builds
Semiconductor products (SPS) via assembly processes using dicing, bonding, and reflow systems.
Domain
Semiconductor manufacturing / Industrial Automation
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work
Required skills
Machine stability & maintenance (Dicing, Pellet Bonder, Wire Bonder), Production planning & new product support, Cost reduction & capacity expansion, Safety & compliance (ISO/IATF), 5S & 3Tei practices, SPS process & equipment technical competency (ASMPT, ViTrox, Canon, 3S systems), Troubleshooting & preventive maintenance, Equipment reliability improvement
Preferred skills
Programming (Python, Java, C/C++, JavaScript, TypeScript, MySQL), AI & Power Automation knowledge, Mandarin proficiency
Technologies
ASMPT Solder Printers, ViTrox Inspection Systems, Canon Bonding Platforms, 3S Reflow Systems, CMMS, TPM
Responsibilities
Develop and review PM standards, coordinate major machine repairs, implement cost reduction projects, mentor and train peers and technicians, adhere to safety regulations and manage EHS concerns, maintain 5S & 3Tei practices and update documentation systems
Seniority
Mid-level, hands-on IC