Dir, Package Design Engineering
Core
Lead global Packaging Sustaining Engineering for high-volume semiconductor manufacturing across internal assembly sites and OSAT partners in Asia, ensuring manufacturing excellence, yield, quality, and cost competitiveness.
Role type
Senior IC Director of Packaging Sustaining Engineering
Builds
High-volume semiconductor packages (FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, 2.5D) for Automotive, Industrial, Infrastructure, and IoT markets
Domain
Semiconductor manufacturing / Packaging Engineering
Deliverable
production ML models | product features | dashboards & analysis | research | client delivery | infrastructure | physical/clinical work -> physical/clinical work (manufacturing sustainment)
Required skills
Assembly Engineering, OSAT management, Yield Improvement, Process Excellence (SPC, DOE, PFMEA), Cost Optimization, Product Change Notification (PCN), Material Review Board (MRB), Supplier Audits, Failure Analysis (RCA, CAPA), Substrate expertise (MSAP, ETS, Tenting, ABF), SMT process, Board Level Reliability testing, Industry standards (JEDEC, IPC, Automotive quals)
Preferred skills
Automotive Packaging experience, Leadership of geographically distributed teams, Industry benchmarking, Competitive analysis
Technologies
SPC, DOE, PFMEA, 8D, RCA, SYL/SBL, MSAP, ETS, Tenting, ABF, FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, 2.5D
Responsibilities
Lead Manufacturing Sustaining Engineering for all released production packages; Own Customer RMA, failure analysis, RCA, CAPA and customer communications; Drive Yield Improvement and Process Excellence; Lead Cost Optimization through process, material and manufacturing improvements; Own Product Change Notification (PCN) planning, qualification and implementation; Manage OSAT suppliers, supplier audits, scorecards and technology alignment
Seniority
Director, Executive ownership
