Senior Equipment Engineer (Wire Bond)
Core
Drive wire bonding equipment performance and reliability to meet production targets by improving OEE and minimizing unplanned downtime.
Role type
Senior Equipment Engineer (Wire Bond)
Builds
Semiconductor wire bonding equipment
Domain
Semiconductor manufacturing / Equipment maintenance
Deliverable
infrastructure
Required skills
troubleshooting, root cause analysis, preventive maintenance planning, equipment performance metrics analysis, cross-functional collaboration, technical coaching
Preferred skills
wire bonding equipment experience (Shinkawa, K&S), structured problem-solving, equipment reliability optimization, automation/vision systems knowledge, predictive maintenance
Technologies
Shinkawa UTCx000 series, K&S Iconn
Responsibilities
Drive and improve equipment performance metrics (OEE, MTBC, UDT); Lead troubleshooting and root cause analysis for equipment-related issues; Plan and optimize preventive maintenance strategies and schedules; Monitor equipment performance trends and drive improvement initiatives; Collaborate with production, process, and vendors to implement effective solutions; Coach and guide technicians on technical problem-solving and best practices
Seniority
Senior, hands-on IC
